YPlasma zaps the air to cool chips for data centers

YPlasma zaps the air to cool chips for data centers


A seemingly magical demo from YPlasma shows five candles being extinguished by an invisible airflow generated without any moving parts. The secret lies in plasma actuators—thin, flexible copper strips that use electrical currents to create charged particle clouds, manipulating air with remarkable efficiency.

Compared to traditional cooling fans consuming 3-4 watts, YPlasma’s system achieves the same results with just 1 watt, offering significant energy savings. Its compact design makes it ideal for modern electronics, where space constraints challenge conventional cooling methods. A partnership with a major semiconductor manufacturer underscores its potential in high-performance applications.

Following a $2.5 million seed round led by Faber and SOSV, YPlasma is accelerating R&D at SOSV’s facilities in Newark and Madrid. Originally a spin-off from Spain’s space agency (INTA), the company’s plasma technology extends beyond cooling—targeting wind turbine efficiency, aircraft de-icing, satellite propulsion, and even atmospheric water harvesting.

For wind turbines, the actuators reduce drag and prevent ice buildup, potentially boosting energy output by 10-15%. Upcoming trials at Sandia National Laboratories aim to validate these benefits. Meanwhile, data centers present a critical opportunity. With cooling costs spiraling, YPlasma’s solution bridges the gap between basic fans and expensive liquid/immersive systems, offering a cost-effective alternative for an industry eager to optimize expenses.


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